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G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded SEMI M50-1101 (first published)

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Description

SEMI M50-1101 (first published)

This test procedure evaluates quantitatively the durability of flat panel display (FPD) glass substrates using reagents employed in FPD production processes

SEMI E40-0309 (technical revision)

6-81 (first published)

G09000 - SEMI G90 - Specification for 300 mm Wafer Coin-Stack Type Shipping Container Used for Test and Packaging Processes Revision:SEMI G90-0811 (Reapproved 0318) - Superseded SEMI M50-1101 (first published)The purpose of this Standard is to standardize the specifications for 300 mm wafer coin stack type shipping container used for test and packaging processes for wafers. This Specification defines the dimensions of container (refer to 5. 1. 1) and requirements for securing the interface between container and processing equipment or wafer transportation equipment. This Standard specifies the requirements for wafer spacers used for separation of wafers

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