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and SEMI C12
SEMI C92-0216 (replaced by SEMI F119)
Maintenance
the Current version is the official and authoritative version
3D01800 - SEMI 3D18 - Guide for Wafer Edge Trimming for 3DS-IC Process StdPbc-0924 and SEMI C123DS IC wafer edge trimming process is a key step for successful wafer thinning after the wafer bonded in the 3DS IC process. This Guide provides a feasible approach to perform the wafer edge trimming. This Document provides guidance for specifying edge trimming and resultant particle count to ensure the successful wafer thinning process after the wafer edge trimming. This Document covers guidance for specifying wafer edge trimming and resultant
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